Huawei and Intel Sign a MOU to Accelerate HPC Innovation
[Hannover, Germany, April 25, 2017] Huawei and Intel signed a memorandum of understanding (MOU) to cooperate in high-performance computing (HPC) to provide competitive and innovative HPC products and solutions. Today, Huawei and Intel held the global HPC collaboration launch ceremony at Hannover Messe 2017, underscoring the beginning of the two partners' deeper collaboration in HPC innovation.
Huawei and Intel at collaboration launch ceremony at Hannover Messe 2017
According to the collaboration plan, the two parties will desire to develop HPC solutions based on Huawei servers and cloud platforms which are powered by Intel® Xeon® processor, Intel® Xeon PhiTM processors and Omni-Path Architecture (OPA). Huawei will also build HPC innovation centers in Shenzhen and Chengdu, China, as well as in Munich, Germany. At these centers, the two parties may carry out joint initiatives such as application optimization, technical training and community development, so that they can provide cutting-edge HPC solution experience and services for customers. Additionally, they will carry out joint exploration and marketing events across the globe.
"The combining of Big Data, Cloud, AI, and traditional HPC is bringing new opportunities and vitality to the entire HPC industry. This trend also extends the application of HPC from traditional domains such as CAE simulation, scientific research computing, and oil and gas exploration towards nascent domains such as financial services and network security," said Qiu Long, President, IT Server Product Line, Huawei. "Huawei has synergized its leading engineering and chip expertise in the hardware space with its strength in Big Data and cloud computing. This well positions Huawei for accelerating the HPC industry upgrading as the new opportunities arrive. Huawei will strive to provide customers with leading-edge solutions to help them better compete in emerging sectors such as HPC Cloud, HPDA, and HPC & AI. Intel has been pioneering the HPC industry and is also the most important partner to Huawei in the server domain. The kickstart of both parties' deep collaboration in HPC sets a new milestone in our collaboration history. Together we will enrich the HPC industry with more innovations and empower our customers with more compelling HPC solutions."
“Intel is keen to see acceleration of the HPC market through deeper collaboration with Huawei. Intel Xeon processors and Intel Xeon Phi™ processors, as wells as our low-latency Intel Omni-Path Architecture fabric, deliver the performance demanded by HPC applications,” said Peter Chen, General Manager of Products & Technology, Data Center Group Sales Group. “Intel will work closely with Huawei on product development, innovation lab and technology training. Our engagement also covers marketing alignment. We are excited on the partnership and how Huawei and Intel can transform HPC market together.”
In recent years, Huawei has advanced its collaboration with Intel in HPC. Last November, Intel joined Huawei at Supercomputing Conference 2016 (SC16) to launch the new-generation all-flash based HPC platform, FusionServer X6000. This March, Intel joined Huawei at CeBIT 2017 to release the Intel® OPA solution based Huawei E9000 blade server. For industrial CAE simulation and simulation for scientific research purposes, Huawei offers a variety of HPC solutions based on FusionServer high-density servers and the KunLun. Currently, Huawei has successfully helped many automobile manufacturers, large supercomputing centers, universities, and scientific research institutions deploy HPC clusters. According to Gartner's statistics, Huawei server shipments ranked No. 3 globally in Q4 2016.
